@lanodan @redsPL @Ste1lar
It kind of is - usually it's just enough for the cracked lead-free solder balls to melt and resolidify, but the oxidation layer is typically already there so they rarely fully reform properly
It's a decent temporary/mid-term fix, but it rarely works long-term
I have a graphics card (Radeon 6870) that conks out every three months or so, so far I've been able to resuscitate it
@lanodan @Ste1lar @redsPL
Even though it survived 10+ cycles of me heatraping the chip with the heat gun, I don't think it'll last much longer
Thermal expansion/contraction cycles also damage thin traces, potentially to the point of pads breaking off
@Ste1lar @lanodan @redsPL
Another problem is, the cracked balls are frequently not between the interposed and the board (adding flux or reballing works wonders in that case, the chip is usually fully functional in that scenario), but between the silicon chip and the interposer, which has underfill there and can go pop-pop
@lanodan @Ste1lar @redsPL
Yep! I've seen a few DIY reflow oven projects, they're pretty cool
They're usually used when you need to populate an empty board with new components (that required masks to apply flux+solder paste first and manual component placement), but they can also be used to reball chips, if you're careful enough
I'd probably still prefer a good SMD rework station with IR heating and thermal profiles, personally
Sign in to participate in the conversation

Welcome to your niu world ! We are a cute and loving international community O(≧▽≦)O !